- The Effect of TiO2 Addition on Low-temperature Sintering Behaviors in a SnO2-CoO-CuO System
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Jae-Sang Lee, Kyung-Sik Oh, Yeong-Kyeun Paek
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J Powder Mater. 2024;31(2):146-151. Published online April 30, 2024
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DOI: https://doi.org/10.4150/jpm.2024.00024
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 Abstract
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- Pure SnO2 has proven very difficult to densify. This poor densification can be useful for the fabrication of SnO2 with a porous microstructure, which is used in electronic devices such as gas sensors. Most electronic devices based on SnO2 have a porous microstructure, with a porosity of > 40%. In pure SnO2, a high sintering temperature of approximately 1300C is required to obtain > 40% porosity. In an attempt to reduce the required sintering temperature, the present study investigated the low-temperature sinterability of a current system. With the addition of TiO2, the compositions of the samples were Sn1-xTixO2-CoO(0.3wt%)-CuO(2wt%) in the range of x ≤ 0.04. Compared to the samples without added TiO2, densification was shown to be improved when the samples were sintered at 950C. The dominant mass transport mechanism appears to be grain-boundary diffusion during heat treatment at 950C.
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